Methods and apparatus for addition of electrical conductors...

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Making plural separate devices

Reexamination Certificate

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C438S462000, C257SE21602

Reexamination Certificate

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07638366

ABSTRACT:
A conductor carrier provides, separately manufactured, conductive pathways, on a wafer level, which may be coupled to a wafer of fully fabricated integrated circuits. Such conductor carriers include an insulating body having two major surfaces with conductors disposed on each of those surfaces, and conductors disposed within the insulating body so as to provide signal continuity between various conductors on each of the two surfaces. An assembly can be formed by permanently or removably attaching the conductor carrier to the wafer. Conductor carriers may include an evacuation pathway suitable for removing air, or other gases, from between the conductor and the wafer so as to create a pressure differential that urges the conductor carrier into contact with the wafer. Conductor carriers may include a groove which is suitable for receiving a sealing ring; and may include a street map which is suitable for providing guidance to a wafer sawing operation.

REFERENCES:
patent: 5346861 (1994-09-01), Khandros et al.
patent: 5612576 (1997-03-01), Wilson et al.
patent: 6417029 (2002-07-01), Fjelstad
patent: 6730541 (2004-05-01), Heinen et al.
patent: 6991969 (2006-01-01), Johnson
patent: 7282931 (2007-10-01), Johnson
patent: 2001/0044197 (2001-11-01), Heinen et al.

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