Computer-aided design and analysis of circuits and semiconductor – Nanotechnology related integrated circuit design
Reexamination Certificate
2005-04-12
2005-04-12
Niebling, John F. (Department: 2812)
Computer-aided design and analysis of circuits and semiconductor
Nanotechnology related integrated circuit design
C382S149000
Reexamination Certificate
active
06880140
ABSTRACT:
A method and system for selectively identifying reliability risk die based on characteristics of local regions on a wafer by computing particle sensitive yield and using the particle sensitive yield to identify reliability risk die. Specifically, a bin characteristics database which identifies hard and soft bins that are sensitive to different failure mechanisms is maintained, and the bin characteristics database is used to compute particle sensitive yield. It is determined whether the particle sensitive yield of the local region around the current die is less than a pre-set threshold, and the die is downgraded if the particle sensitive yield of the local region around the current die is less than the pre-set threshold. If the particle sensitive yield of the local region around the current die is not less than the pre-set threshold, the die is not downgraded.
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Barnett, Thomas S. et al., “Burn-In Failures and Local Region Yield: An Integrated Yield-Reliability Model”, Auburn University.
Barnett, Thomas S. et al., “Yield-Reliability Modeling: Experimental Verification and Application to Burn-In Reduction”, Auburn University.
Abercrombie David
Cota Kevin
Gonzales Ramon
Rehani Manu
LSI Logic Corporation
Niebling John F.
Stevenson Andre′ C.
Trexler, Bushnell, Giangiorgi & Blackstone, LTD.
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