Method to produce via holes in polymer dielectrics for multiple

Details Method to produce via holes in polymer dielectrics for multiple Method to produce via holes in polymer dielectrics for multiple

1986-09-26

1987-12-22

Powell, William A.

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

156643, 156644, 156646, 156655, 156668, 20419236, B44C 122, B29C 3700, C03C 1500, C03C 2506

Patent

active

047145161

ABSTRACT:
A method for producing holes in a polymer film includes the steps of irradiating a spot on the film with a burst of focused laser energy at a level sufficient to damage the film without puncturing it and then subsequently plasma etching the irradiated film so as to remove the damaged portions. This method is particularly applicable to the formation of multichip integrated circuit packages in which a plurality of microcircuit chips are affixed to an underlying substrate which is coated with a polymer film covering the chips and the substrates. The holes are provided for the purpose of interconnecting the chips or making intrachip connections by means of a subsequently applied metallization layer.

REFERENCES:
patent: 4417393 (1983-11-01), Becker
patent: 4417948 (1983-11-01), Mayne-Banton et al.
patent: 4508749 (1985-04-01), Brannon et al.
Jubb, Charles, "PC Board Layout Via AutoCAD", Cadence, vol. 1, No. 2, pp. 51-55.
Angell, Richard, "End-to-End Design", PC Tech Journal, vol. 4, No. 11, Nov. 1986, pp. 97-119.
Clark, R. J. and Nakagawa, T., "The STD Process-New Developments and Applications", Abstract from the 1974 Microelectronics Symposium held Oct. 1974, pp. 131-144.
High Technology, Oct. 1986, p. 55.
"Embedding ICs in Plastic Cuts Interconnect Space", Electronics, Jun. 9, 1986, pp. 17 and 20.
Hennpenheimer, T. A., "Monster Chips", Popular Science, pp. 104, 106, 108 and 110.

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