Method to produce dual gates (one metal and one poly or...

Semiconductor device manufacturing: process – Making field effect device having pair of active regions... – Having insulated gate

Reexamination Certificate

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C438S275000, C438S532000, C438S592000, C438S659000

Reexamination Certificate

active

06841441

ABSTRACT:
A method of fabricating first and second gates comprising the following steps. A substrate having a gate dielectric layer formed thereover is provided. The substrate having a first gate region and a second gate region. A thin first gate layer is formed over the gate dielectric layer. The thin first gate layer within the second gate region is masked to expose a portion of the thin first gate layer within the first gate region. The exposed portion of the thin first gate layer is converted to a thin third gate layer portion. A second gate layer is formed over the thin first and third gate layer portions. The second gate layer and the first and third gate layer portions are patterned to form a first gate within first gate region and a second gate within second gate region.

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patent: 6589836 (2003-07-01), Wang et al.

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