Method to prepare TEM samples

Radiant energy – Inspection of solids or liquids by charged particles – Methods

Reexamination Certificate

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C250S440110, C250S304000

Reexamination Certificate

active

07112790

ABSTRACT:
A method for preparing a transmission electron microscopy (TEM) sample is provided which includes removing a portion of a substrate using a focused ion beam tool and securing the removed portion to a support structure to form a grafted structure. The method further includes forming an opening within the support structure to expose an underside of the removed portion and thinning the exposed underside using an ion beam miller tool. In some cases, the step of securing the removed portion to the support structure may include placing the substrate specimen upon a film attached to a mesh grid, positioning the mesh grid upon a framework comprising the support structure such that the substrate specimen is above the support structure, and pushing the substrate specimen through the film onto the support structure. A TEM sample resulting from such methods is also provided.

REFERENCES:
patent: 5572026 (1996-11-01), Ikeda
patent: 6828566 (2004-12-01), Tomimatsu et al.
Liu et al., “A Methodology to Reduce Ion Beam Induced Damage in TEM Specimens Prepared by FIB,” Int'l Symposium for Testing and Failure Analysis, Nov. 2002, pp. 313-316.
Overwijk et al., “Novel scheme for the preparation of transmission electron microscopy specimens with a focused ion beam,” J. Vac. Sci. Technol. B, vol. 11 No. 6, Nov./Dec. 1993, pp. 2021-2024.
Leslie et al., “TEM Sample Preparation Using FIB: Practical Problems and Artifacts,” Int'l Symposium for Testing and Failure Analysis, Nov. 1995, pp. 353-362.
Rossie et al., “A Method for Thinning FIB Prepared TEM Specimens After Lift-Out,” Microscopy & Microanalysis, vol. 7, Suppl. 2, pp. 940-941.
Liu et al., “A Methodology to Reduce Ion Beam Induced Damage in TEM Specimens Prepared by FIB,” Int'l Symposium for Testing and Failure Analysis, Nov. 2002, pp. 313-316.
Young et al., “High-Yield and High-Throughput TEM Sample Preparation Using Focused Ion Beam Automation,” Int'l Symposium for Testing and Failure Analysis, Nov. 1998, pp. 329-336.
Giannuzzi et al., “A review of focused ion beam milling techniques for TEM specimen preparation,” Micron, vol. 30, 1999, pp. 197-204.

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