Method to obtain fully silicided poly gate

Semiconductor device manufacturing: process – Making field effect device having pair of active regions... – Having insulated gate

Reexamination Certificate

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Details

C438S303000, C438S592000, C438S595000, C257SE29161, C257SE21199

Reexamination Certificate

active

07396716

ABSTRACT:
The present invention provides a method of fabricating a microelectronics device. In one aspect, the method comprises forming a capping layer610over gate structures230located over a microelectronics substrate210wherein the gate structures230include sidewall spacers515and have a doped region525located between them. A protective layer710is placed over the capping layer610and the doped region525, and a portion of the protective layer710and capping layer610that are located over the gate structures are removed to expose a top surface of the gate structures230. A remaining portion of the protective layer710and capping layer610remains over the doped region525. With the top surface of the gate structures230exposed, metal is incorporated into the gate structures to form gate electrodes230.

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