Method to monitor pad wear in CMP processing

Details Method to monitor pad wear in CMP processing Method to monitor pad wear in CMP processing

2007-04-03

2007-04-03

Shakeri, Hadi (Department: 3723)

Abrading

Precision device or process - or with condition responsive...

With indicating

C451S028000, C451S005000, C451S527000

Reexamination Certificate

active

10879629

ABSTRACT:
A pad groove analyzer and associated method configured to assess the grooves on the pad and determine how worn the pad is. The pad groove analyzer may be configured to monitor the grooves via a contact or no-contact process. In a contact process, the pad groove analyzer may include a stylus which physically contacts and moves along the pad. As the stylus falls into the grooves in the pad as the stylus moves along the pad, signals are created, and a stylus monitor uses the signals to determine to what extent the pad is worn. The stylus monitor can be configured to communicate with the general tool controller. In a no-contact process, the pad groove analyzer may take several different forms.

REFERENCES:
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patent: 6045434 (2000-04-01), Fisher et al.
patent: 6616513 (2003-09-01), Osterheld
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patent: 6702646 (2004-03-01), Gitis et al.
patent: 2002/0137434 (2002-09-01), Choi et al.
patent: 2003/0060127 (2003-03-01), Kaushal et al.

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