Method to make corner cross-grid structures in copper...

Semiconductor device manufacturing: process – Semiconductor substrate dicing – Having specified scribe region structure

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C438S113000, C438S637000, C438S926000, C257S048000, C257SE21575, C257S620000

Reexamination Certificate

active

07314811

ABSTRACT:
A new method to prevent cracking at the corners of a semiconductor die during dicing is described. Dummy metal structures are fabricated at the corners of the die to prevent cracking. The design for the dummy metal structures can be generated automatically by a computer program.

REFERENCES:
patent: 4928162 (1990-05-01), Lesk et al.
patent: 5572067 (1996-11-01), Thalapaneni
patent: 5846874 (1998-12-01), Hartranft et al.
patent: 6022792 (2000-02-01), Ishii et al.
patent: 6479887 (2002-11-01), Yoon et al.
patent: 6528392 (2003-03-01), Feurle et al.
patent: 2002/0043700 (2002-04-01), Sasaki et al.
patent: 2004/0002198 (2004-01-01), Lee et al.
patent: 2004/0121577 (2004-06-01), Yu et al.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Method to make corner cross-grid structures in copper... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method to make corner cross-grid structures in copper..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method to make corner cross-grid structures in copper... will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-2783334

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.