Method to improve transistor tox using SI recessing with no...

Semiconductor device manufacturing: process – Making field effect device having pair of active regions... – Having insulated gate

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C257SE21409, C257SE21632

Reexamination Certificate

active

07892930

ABSTRACT:
A method of forming a transistor device is provided wherein a gate structure is formed over a semiconductor body of a first conductivity type. The gate structure is formed comprising a protective cap thereover and defining source/drain regions laterally adjacent thereto. A first implant is performed of a second conductivity type into both the gate structure and the source/drain regions. The semiconductor body is etched to form recesses substantially aligned to the gate structure wherein the first implant is removed from the source/drain regions. Source/drain regions are implanted or grown by a selective epitaxial growth.

REFERENCES:
patent: 6037230 (2000-03-01), Holloway
patent: 6440791 (2002-08-01), Gau
patent: 2005/0164458 (2005-07-01), Honeycutt
patent: 2006/0024898 (2006-02-01), Chidambaram et al.
patent: 2006/0073665 (2006-04-01), Jain
patent: 2007/0020839 (2007-01-01), Sridhar et al.
patent: 2007/0032028 (2007-02-01), Zhu et al.
patent: 2007/0059907 (2007-03-01), Hierlemann
patent: 2007/0066024 (2007-03-01), Chakravarthi et al.
Lee et al., “Improved NiSi Salicide Process Using . . . ”, 2000, IEEE Electron Device Latters, vol. 21, No. 12, pp. 566-568.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Method to improve transistor tox using SI recessing with no... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method to improve transistor tox using SI recessing with no..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method to improve transistor tox using SI recessing with no... will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-2635529

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.