Method, program product and apparatus for model based...

Computer-aided design and analysis of circuits and semiconductor – Nanotechnology related integrated circuit design

Reexamination Certificate

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C716S030000, C430S005000

Reexamination Certificate

active

07493589

ABSTRACT:
A method of decomposing a target pattern having features to be imaged on a substrate so as to allow said features to be imaged in a multi-exposure process. The method includes the steps of: (a) segmenting a plurality of the features into a plurality of polygons; (b) determining the image log slope (ILS) value for each of the plurality of polygons; (c) determining the polygon having the minimum ILS value, and defining a mask containing the polygon; (d) convolving the mask defined in step (c) with an eigen function of a transmission cross coefficient so as to generate an interference map, where the transmission cross coefficient defines the illumination system to be utilized to image the target pattern; and (e) assigning a phase to the polygon based on the value of the interference map at a location corresponding to the polygon, where the phase defines which exposure in said multi-exposure process the polygon is assigned.

REFERENCES:
patent: 4894790 (1990-01-01), Yotsuya et al.
patent: 5097138 (1992-03-01), Wakabayashi et al.
patent: 5307296 (1994-04-01), Uchida et al.
patent: 5307421 (1994-04-01), Darboux et al.
patent: 5319564 (1994-06-01), Smayling et al.
patent: 5416729 (1995-05-01), Leon et al.
patent: 5621652 (1997-04-01), Eakin
patent: 5795688 (1998-08-01), Burdorf et al.
patent: 5825647 (1998-10-01), Tsudaka
patent: 5966312 (1999-10-01), Chen
patent: 5969441 (1999-10-01), Loopstra et al.
patent: 6046792 (2000-04-01), Van Der Werf et al.
patent: 6081659 (2000-06-01), Garza et al.
patent: 6289499 (2001-09-01), Rieger et al.
patent: 6355382 (2002-03-01), Yasuzato et al.
patent: 6492066 (2002-12-01), Capodieci et al.
patent: 7065738 (2006-06-01), Kim
patent: 7155689 (2006-12-01), Pierrat et al.
patent: 7398508 (2008-07-01), Shi et al.
patent: 2003/0118917 (2003-06-01), Zhang et al.
patent: 2003/0126581 (2003-07-01), Pang et al.
patent: 2004/0123265 (2004-06-01), Andreev et al.
patent: 2005/0044513 (2005-02-01), Robles et al.
patent: 2005/0142449 (2005-06-01), Shi et al.
patent: 2005/0268256 (2005-12-01), Tsai et al.
patent: 2007/0031745 (2007-02-01), Ye et al.
patent: 1 329 771 (2003-07-01), None
patent: 1465016 (2004-10-01), None
Pati Y.C. et al. “Exploiting Structure in Fast Aerial Image Computation for Integrated Circuit Patterns.” IEEE Transactions on Semiconductor Manufacturing, Feb. 1997, IEEE, USA, vol. 10, No. 1, pp. 62-74, XP002256517.
Mack C A . et al “Metrology, Inspection, and Process Control for Microlithography XV.” Santa Clara CA, Feb. 26, 2001-Mar. 1, 2001, vol. 4344, pp. 377-384, XP 008022568.
Cobb N, et al. “Mathematical and CAD Framework for Proximity Correction.” Optical Microlithography IX, Santa Clara, CA, Mar. 13-15, 1996, vol. 2726, pp. 208-222, XP008022569.
Yeung M.S., et al. “Extension of the Hopkins theory of partially coherent imaging to include thin-film interference effects” 452/SPIE vol. 1927 Optical/Laser Microlithography VI (1993).
Randall J. et al. “Variable Threshold Resist Models for Lithography Simulation” XP008001832, PD Mar. 17, 1999, pp. 176-182.
Crisalle O.D.. et al., “A Comparison of the Optical Projection Lithography Simulators in Sample and Prolith” IEEE Translactions on Semiconductior MA, vol. 5, No. 1. Feb. 1992.
Gopalarao K. S. V. et al., “An Integrated Technology CAD System for Process and Device Designers”, IEEE Transactions on Very Large Scale Integration (VLSI) Systems, vol. 1, No. 4, Dec. 1993.
Neubauer, G. et al., “Imaging VLSI Cross Sections by Atomic Force Microscopy”, CH3084-1/92/0000-0299$01.00 @ 1992 IEEE/IRPS.
Rodgers M., “Application of the Atomic Force Microscope to Integrated Circuit Reliability and Failure Analysis”, CH2974-4/91/0000-0250$01.00 @ 1991 IEEE/IRPS.
Qian Q.E. et al., “A New Scalar Planewave Model for High NA Lithography Simulations”, TH0640-3/94/0000-0045 $3.00 @1994 IEEE.
Barouch E. et al., “Modeling Process Latitude in UV Projection Lithography”, vol. 12, No. 10, Oct. 1991.
Peters L. “AFMs: What Will Their Role Be?” 62/Semiconductor International Aug. 1993.

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