Optics: measuring and testing – Shape or surface configuration
Reexamination Certificate
2005-12-13
2005-12-13
Toatley, Jr., Gregory J. (Department: 2877)
Optics: measuring and testing
Shape or surface configuration
C356S399000, C356S401000, C355S055000, C355S053000, C355S077000
Reexamination Certificate
active
06975407
ABSTRACT:
An improved method of wafer height mapping using a wafer level sensor eliminates or substantially minimizes the “spacing” in the wafer height mapping data usually caused by having an exposure field on a wafer whose width is less than the width of the measurement spot array of the wafer level sensor and also not being a multiple of the width of a single measurement spot. According to the improved method, the measurement spot array is first translated towards one edge of the exposure field and scanned. Then the measurement spot array is translated towards the other edge of the exposure field and scanned second time to map the area that was missed during the first mapping scan.
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Liao Chi-Hung
Liu Louie
Sung Yi-Chang
Turn Li-Kong
Wang Chun-Sheng
Duane Morris LLP
Nguyen Sang H.
Taiwan Semiconductor Manufacturing Co Ltd.
Toatley , Jr. Gregory J.
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