Method of treating photoresists

Radiation imagery chemistry: process – composition – or product th – Imaging affecting physical property of radiation sensitive... – Forming nonplanar surface

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430328, G03C 536

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active

048680958

ABSTRACT:
Ultraviolet radiation process applied to manufacture semiconductor devices in order to enhance the thermal stability of the photoresist film on semiconductor wafers.
A method, in ultraviolet radiation process, enabling effective treatment of the developed positive photoresist image employing ultraviolet irradiation by preventing the deformation of the developed positive photoresist image which is caused by exposing it to high ultraviolet radiation at the beginning of exposure. This method employs ultraviolet irradiation, in which the developed positive photoresist image placed in gas of a lower atmospheric pressure is exposed to ultraviolet radiation of low intensity at the beginning of exposure, and then exposed to ultraviolet radiation, the intensity of which increases little by little or in steps.

REFERENCES:
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Moran et al., "Plasma Treatment to Improve Resist Properties . . .", J. Vac. Sci. Technol., 19(4), Nov./Dec. 1981, pp. 1127-1131.
Allen et al., "Deep UV Hardening of Positive Photoresist . . .", Xerox Palto Alto Research Center, Accelerated Brief Comm., 1982, pp. 1379-1381.
H. Hiraoka and J. Pacansky: J. Vac. Sci. Tech. 19 (1981), p. 1132.
H. Hiraoka and J. Pacansky: J. Electrochem. Soc., 128 (1981) p. 2645.
R. Allen et al.: J. Electrochem. Soc., 129 (1982), p. 1379.
J. C. Matthews and J. I. Willmott, Jr.: Microlithography III Spie, (1984).
Y. Takasu et al.: Proc. Dry Process Symposium, (1984), p. 60.
H. Yanazawa et al.: J. Appl. Polymer Sci., 30 (1985) p. 547.

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