Method of treating a semiconductor substrate

Details Method of treating a semiconductor substrate Method of treating a semiconductor substrate

2011-07-26

2011-07-26

Fourson, George (Department: 2823)

Semiconductor device manufacturing: process

Chemical etching

Combined with coating step

C438S964000, C257SE21228

Reexamination Certificate

active

07985683

ABSTRACT:
A method of treating a semiconductor substrate has forming convex patterns over the semiconductor substrate by dry etching, cleaning and modifying a surface of the convex patterns by using chemical, forming a hydrophobic functional surface on the modified surface of the convex patterns, after forming the hydrophobic functional surface, rinsing the semiconductor substrate by using water, drying the semiconductor substrate, and removing the hydrophobic functional group from the hydrophobic functional surface of the convex patterns.

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