Method of surface treating substrates and method of...

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material

Reexamination Certificate

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C438S690000, C438S906000, C257SE21697

Reexamination Certificate

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07432186

ABSTRACT:
Affords methods of surface treating a substrate and of manufacturing Group III-V compound semiconductors, in which a substrate made of a Group III-V semiconductor compound is rendered stoichiometric, and microscopic roughness on the surface following epitaxial growth is reduced. The methods include preparing a substrate made of a Group III-V semiconductor compound (S10), and cleaning the substrate with a cleaning solution whose pH has been adjusted to an acidity of 2 to 6.3 inclusive, and to which an oxidizing agent has been added (S20).

REFERENCES:
patent: 5763016 (1998-06-01), Levenson et al.
patent: 2005/0023552 (2005-02-01), Chang et al.
patent: 2005/0081885 (2005-04-01), Zhang et al.
patent: 0617458 (1994-09-01), None
patent: 1530232 (2005-05-01), None
patent: S62-252140 (1987-11-01), None
patent: 2001-044169 (2001-02-01), None
patent: 2001-189278 (2001-07-01), None
A. Guivarc′ H, et al. “Chemical Cleaning of InP Surfaces: Oxide Composition and Electrical Properties,” Journal of Applied Physics, Feb. 1984, pp. 1139-1148, vol. 55, No. 4, American Institute of Physics, NY.
J. Olivier, et al. “Chemical Cleaning Procedures of GaAs (100) Surfaces Studied by X-ray Photoelectron Spectroscopy,” Sep. 24, 1990, pp. 305-310, vol. Symp. 17. Gallium Arsenide and Related Compounds, Sep. 24-27, 1990, Institute of Physics, Bristol, Philadelphia and New York.
Y. Sun, et al. “Optimized Cleaning Method for Producing Device Quality InP(100) Surfaces,” Journal of Applied Physics 97, 124902 (2005), pp. 124902-1 through 124902-7, American Institute of Physics, NY.
Y. Tao, et al. “S-passivated Inp(100)-(1X1) Surface Prepared by a Wet Chemical Process,” Appl. Phys. Lett. 60 (21), May 25, 1992, pp. 2669-2671, American Institute of Physics, NY.

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