Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step
Patent
1982-10-18
1985-04-30
Bernstein, Hiram H.
Adhesive bonding and miscellaneous chemical manufacture
Delaminating processes adapted for specified product
Delaminating in preparation for post processing recycling step
156613, 156DIG103, 118725, 427 55, 427 86, B05D 306, H01L 2120, C23C 1300
Patent
active
045142505
ABSTRACT:
Strain-free mounting and uniform heating of deposition substrates are achieved by coating the backside of the substrate such as a GaAs substrate with a reflective layer. A reflective environment formed, for example, by tantalum foils allows reflections between the reflective surface of the substrate and the reflective surface of the environment. These multiple reflections, in turn, produce uniform heating of the substrate.
REFERENCES:
patent: 3627590 (1971-12-01), Mammel
patent: 3634150 (1972-01-01), Horn
patent: 4081313 (1978-03-01), McNeilly et al.
AT&T Bell Laboratories
Bernstein Hiram H.
Carrier Joseph P.
Schneider Bruce S.
LandOfFree
Method of substrate heating for deposition processes does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Method of substrate heating for deposition processes, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of substrate heating for deposition processes will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-1966759