Method of structuring of a substrate

Details Method of structuring of a substrate Method of structuring of a substrate

2007-09-18

2007-09-18

Walke, Amanda (Department: 1752)

Radiation imagery chemistry: process, composition, or product th

Imaging affecting physical property of radiation sensitive...

Making electrical device

C430S313000, C430S314000, C430S325000, C430S330000

Reexamination Certificate

active

10707288

ABSTRACT:
The invention relates to a method of structuring of a substrate by providing a polymerization starter layer on the substrate, applying a radiation field on the polymerization starter layer for selectively reducing a density of polymerization starters of the polymerization starter layer, applying monomers and then polymerizing of the monomers, the polymerization being initiated by the starters of the polymerization starter layer, and structuring the substrate using the polymerized monomers as a mask.

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patent: WO 200254458 (2002-07-01), None
English language abstract of DE 4331519.
SPIE Micromachining & Microfabrication Symposium '96, “Imaging and Resist Technologies for the Micromachining Industry”, David Craven, pp. 1-20.

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