Chemistry: electrical and wave energy – Processes and products – Coating – forming or etching by sputtering
Patent
1994-09-01
1996-04-16
Nguyen, Nam
Chemistry: electrical and wave energy
Processes and products
Coating, forming or etching by sputtering
20419216, 2041922, 20429808, C23C 1434
Patent
active
055079300
ABSTRACT:
A carbon film for protecting a magnetic disk is sputtered by a DC magnetron sputtering method, with the addition of superimposed AC power on the DC power applied to the carbon target. When the carbon film is sputtered for extended period in a production sputtering machine, nodular growth occurs over the sputtering surface of the carbon target. Such nodules are variously called "warts" or "mushrooms" in the industry and they are detrimental to the productivity of the sputtering machine. The size and quantity of the nodules over the target surface increase as the target is sputtered longer, and because these region do not contribute to sputtering, the efficiency of the target decreases. As sputter efficiency decreases, power input must be increased to the target to make up for the loss in the effective sputtering area of the target. Eventually, the power input must be increased to a point where arcing occurs continuously and sputtering cannot be continued. By superimposing AC power onto the DC power applied to the target, virtually all arcing on the carbon target is eliminated, thereby significantly reducing the nodular growth and extending the use of the target.
REFERENCES:
patent: 3461054 (1969-08-01), Vratney
patent: 4713288 (1987-12-01), Kokaku et al.
patent: 4716078 (1987-12-01), Kishine et al.
patent: 4737419 (1988-04-01), Hilden et al.
patent: 4778582 (1988-10-01), Howard
patent: 4786564 (1988-11-01), Chen et al.
patent: 4869797 (1989-09-01), Nagao et al.
patent: 4894133 (1990-01-01), Hedguoth
patent: 4981566 (1991-01-01), Nurczinger
patent: 5045165 (1991-09-01), Yamashita
Annual Technical Conference Proceedings-Society of Vacuum Coaters, vol. 35, 22 Mar. 1992, Baltimore, Md., US pp. 391-394; Scholl R. A. "Process Improvements For Sputtering Carbon And Other Difficult Materials Using Combined A.C. and D.C. Process Power", pp. 392-393.
J. K. Howard, "Thin films for magnetic recording technology: A review", Sep. 15, 1985, IBM Research Laboratory, pp. 1-13.
Francis K. King, "Datapoint Thin Film Media", IEEE Transactions, Magnetics vol. Mag. 17, No. 4, Jul. 1981, pp. 1376-1379.
C. W. Chen et al., "Surface-defect formation in graphite targets during magnetron sputtering", J. Vac. Sci. Technology, A8 (4), Jul./Aug. 1990, pp. 3157-3162.
Diane S. Knight and William B. White, "Characterization of diamond films by Raman spectroscopy", 1989 materials Research Society, J. Mater. Res., vol. 4, No. 2, Mar./Apr. 1989, pp. 385-393.
S. C. Sharma et al., "Growth of diamond films and characterization by Raman, scanning electron microscopy, and x-ray photoelectron spectroscopy", 1990 Materials Research Society, J. Mater. Res., vol. 5, No. 11, Nov. 1990, pp. 2242-2432.
Hobart H. Willard, "Instrumental Methods of Analysis, 6th Edition", Wadsworth Publishing Co., 1981, pp. 217-238.
John L. Vossen and Werner Kern, "Thin Film Processes", RCA laboratories, Academic Press, Inc., 1978, pp. 11-73.
Robert K. Waits, "Planar Magnetron Sputtering", Data Systems Division, Hewlett-Packard, Academic Press Inc., 1978, pp. 131-173.
Lee Kyou H.
Ranjan Rajiv Y.
Trachuk Yuri
Yamashita Tsutomu T.
Komag Incorporated
Nguyen Nam
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