Method of simultaneously siliciding a polysilicon gate and...

Semiconductor device manufacturing: process – Making field effect device having pair of active regions... – Having insulated gate

Reexamination Certificate

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C438S692000, C438S197000

Reexamination Certificate

active

07727842

ABSTRACT:
A method of simultaneously siliciding a polysilicon gate and source/drain of a semiconductor device, and related device. At least some of the illustrative embodiments are methods comprising forming a gate stack over a semiconductor substrate (the gate stack comprising a first polysilicon layer, a first nitride layer, and a second polysilicon layer), forming a second nitride layer over an active region in the semiconductor substrate adjacent to the gate stack, performing a chemical mechanical polishing that stops on the first nitride layer and on the second nitride layer, removing the first nitride layer and the second nitride layer, and performing a simultaneous silicidation of the first polysilicon layer and the active region.

REFERENCES:
patent: 7148097 (2006-12-01), Yu et al.
patent: 7235472 (2007-06-01), Klee et al.
patent: 7410854 (2008-08-01), Yao et al.
patent: 2005/0037580 (2005-02-01), Nakajima et al.
patent: 2006/0105557 (2006-05-01), Klee et al.

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