Method of reducing wafer contamination by removing...

Details Method of reducing wafer contamination by removing... Method of reducing wafer contamination by removing...

2007-01-30

2007-01-30

Wojciechowicz, Edward (Department: 2815)

Semiconductor device manufacturing: process

Making field effect device having pair of active regions...

Having insulated gate

C438S310000, C438S311000, C438S422000, C438S691000, C438S692000, C438S745000, C134S148000, C134S153000, C134S902000

Reexamination Certificate

active

10747722

ABSTRACT:
According to the present invention, a metal and a barrier material, such as copper and a tantalum-based barrier material, are effectively removed from the wafer edge and especially from the bevel by using an etchant that comprises a diluted mixture of hydrofluoric acid and nitric acid. The method is compatible with currently available etch modules for removing metal from the wafer edge, wherein, depending on the hardware specifics, copper, barrier material and dielectric material may be removed in a single etch step, or a first etch step may be performed substantially without any nitric acid so as to avoid the formation of nitric oxides. In this way, the formation of instable layer stacks may be substantially avoided, thereby reducing the risk of material delamination from the substrate edge.

REFERENCES:
patent: 5091047 (1992-02-01), Cleeves et al.
patent: 5340435 (1994-08-01), Ito et al.
patent: 5966628 (1999-10-01), Wei et al.
patent: 6150696 (2000-11-01), Iwamatsu et al.
patent: 6265314 (2001-07-01), Black et al.
patent: 6451696 (2002-09-01), Hara et al.
patent: 6589875 (2003-07-01), Bode et al.
patent: 6615854 (2003-09-01), Hongo et al.
patent: 6784051 (2004-08-01), Lee
Wolf et al., Silicon Processing for the VLSI Era, vol. 1: Process Technology, pp. 400-403 and 532-533, 1986.

Affiliated with

Also associated with

Rating

Method of reducing wafer contamination by removing... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method of reducing wafer contamination by removing..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of reducing wafer contamination by removing... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3730844