Method of reducing generation of particulate matter in a sputter

Details Method of reducing generation of particulate matter in a sputter Method of reducing generation of particulate matter in a sputter

1996-10-31

1999-10-05

Nguyen, Nam

Chemistry: electrical and wave energy

Processes and products

Coating, forming or etching by sputtering

20419232, 20429806, 20429816, 20429831, 20429834, 20429808, C23C 1434

Patent

active

059617934

ABSTRACT:
An RF coil for a plasma chamber in a semiconductor fabrication system is conditioned to reduce shedding of particulate matter onto the workpiece. In the illustrated embodiment, the coil is sputtered prior to sputtering the target so as to remove oxides and other contaminants from the surface of the coil. As a result, shedding of particulate matter from target material subsequently deposited onto the coil is reduced.

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M. Matsuo

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