Method of providing solder bumps on a substrate using...

Details Method of providing solder bumps on a substrate using... Method of providing solder bumps on a substrate using...

2006-09-28

2008-08-05

Malsawma, Lex (Department: 2892)

Semiconductor device manufacturing: process

Coating with electrically or thermally conductive material

To form ohmic contact to semiconductive material

C257S738000, C257SE23021

Reexamination Certificate

active

07407878

ABSTRACT:
A method of providing electrically conductive bumps on electrode pads of a microelectronic substrate. The method includes: providing a microelectronic substrate including electrode pads exhibiting an electrode pad pattern; providing solder portions onto respective ones of the electrode pads according to the electrode pad pattern; reflowing the solder portions to form solder bumps therefrom, reflowing comprising applying localized heating to each of the solder portions to reflow the same.

REFERENCES:
patent: 4806728 (1989-02-01), Salzer et al.
patent: 6521989 (2003-02-01), Zhou
patent: 2002/0064930 (2002-05-01), Ishikawa
patent: 2004/0222271 (2004-11-01), Tor et al.
patent: 2004/0262779 (2004-12-01), Amagai et al.
patent: 2006/0220243 (2006-10-01), Jiang et al.
patent: 2006/0257615 (2006-11-01), Takano et al.

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