Method of producing crystalline semiconductor material and...

Semiconductor device manufacturing: process – Formation of semiconductive active region on any substrate – Amorphous semiconductor

Reexamination Certificate

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C438S487000, C438S488000

Reexamination Certificate

active

11098846

ABSTRACT:
Disclosed are a method of producing a crystalline semiconductor material capable of improving the crystallinity and a method of fabricating a semiconductor device using the crystalline semiconductor material. An amorphous film is uniformly irradiated with a pulse laser beam (energy beam) emitted from an XeCl excimer laser by 150 times so as to heat the amorphous film at such a temperature as to partially melt crystal grains having the {100} orientations with respect to the vertical direction of a substrate and melt amorphous film or crystal grains having face orientations other than the {100} orientations. Silicon crystals having the {100} orientations newly occur between a silicon oxide film and liquid-phase silicon and are bonded to each other at random, to newly form crystal grains having the {100} orientations. Such a crystal grain creation step is repeated, to form a crystalline film which has crystal grains preferentially grown in the {100} orientations with respect to the vertical direction of the substrate and thereby has sharp square-shaped crystal grain boundaries.

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Smith et al, ‘Silicon-on-insulator by graphoepitaxy and zone-melting recrystallization of patterned films’, Journal of Crystal Growth, North-Holland, 1983, vol. 73, pp. 527-546 Section 3 (Relevant to Claim No. 1-37).
Ishihara, R.K., ‘Location control of laterally columnar Si grains by dual-beam excimer-laser melting of Si thin-film’, Materials Research Society Symposium Proceedings, 2000, vol. 621, pp. Q9.4.1-Q9.4.6. Whole document (Relevant to Claim No. 1-37).

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