Method of preparing fine conductive pattern

Details Method of preparing fine conductive pattern Method of preparing fine conductive pattern

1993-11-10

1995-04-18

Powell, William

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

156651, 156657, 1566591, 156667, B44C 122, C03C 1500

Patent

active

054075300

ABSTRACT:
An object of the invention is to provide a method of forming a fine conductive pattern. The method allows the fine conductive pattern whose thickness is relatively large to be formed easily, accurately, and surely. An insulating layer is formed on a substrate. A pattern resist is formed on the insulating layer. Then, the insulating layer is etched downward based on a profile of the pattern resist in a first etching step, and sidewalls of each of groove portions formed by the etching step of the insulating layer are etched sideways in a second etching step, so that overhang portions are defined at the lower edges of the pattern resist portions. Then, conductive film portions are formed by depositing a conductor on the pattern resist, and conductive films that are on the pattern resist are lifted off, so that a fine conductor pattern can be prepared.

REFERENCES:
patent: 4339305 (1982-07-01), Jones
patent: 4568411 (1986-02-01), Martin
patent: 4966648 (1990-10-01), Nakamura et al.

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