Method of polishing a semiconductor wafer

Details Method of polishing a semiconductor wafer Method of polishing a semiconductor wafer

1979-12-05

1981-03-17

Powell, William A.

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

51281R, 156662, H01L 21306

Patent

active

042565359

ABSTRACT:
A semiconductor wafer (31) is placed on a non-porous, flat, substrate (10), with a thin layer of water (21) interposed therebetween. The substrate (10) with the wafer (31) thereon is placed in a polishing machine (40) where a rotating polishing pad (43) polishes the wafer which is permitted to float free and rotate on the thin layer of water (21) during the polishing operation.

REFERENCES:
patent: 3342652 (1967-09-01), Reisman et al.
patent: 3436286 (1969-04-01), Lange
patent: 3860399 (1975-01-01), Noble et al.
patent: 4165584 (1979-08-01), Scherrer
IBM Technical Disclosure Bulletin, vol. 12, No. 12, May 1970, Positive Drive Polishing Machine by J. N. Gowans et al., pp. 2065-2066.
IBM Technical Disclosure Bulletin, vol. 15, No. 6, Nov. 1972, Planetary "Free" Wafer Polished by F. E. Goetz et al., pp. 1760-1761.

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