Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Die bond
Reexamination Certificate
2002-07-03
2008-07-01
Le, Thao X. (Department: 2892)
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Die bond
C257S778000, C257S782000, C257S785000, C438S118000, C438S119000, C228S001100, C228S002100
Reexamination Certificate
active
07394163
ABSTRACT:
A method of mounting a semiconductor chip in which an IC chip is mounted by filling a gap between the chip and a substrate with adhesive which functions as an underfill. The fillet of the underfill is made to have a preferable shape. To accomplish this, a head IC chip provided with bumps is placed on a suspension that is covered with the underfill adhesive and is provided with pads. A bonding tool presses the head IC chip and applies ultrasonic oscillation to the head IC chip, so that the bumps are properly bonded to the pads. When the head IC chip is pressed and subjected to ultrasonic oscillation, the ultraviolet rays108are emitted so as to harden the peripheral portion151aof the adhesive151spread out between the head IC chip11and the suspension12.
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WO 97/38441 English Abstract, Published Oct. 16, 1997.
Korean Office Action mailed Jan. 27, 2006.
Chinese Patent Office Action for corresponding Chinese Patent Application No. 00122531.6 dated Jun. 13, 2003 with translation.
Baba Shunji
Kainuma Norio
Kira Hidehiko
Kobae Kenji
Kobayashi Hiroshi
Kratz Quintos & Hanson, LLP
Le Thao X.
Tran Thanh Y
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