Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step
Patent
1988-12-21
1990-08-07
Powell, William A.
Adhesive bonding and miscellaneous chemical manufacture
Delaminating processes adapted for specified product
Delaminating in preparation for post processing recycling step
156645, 156651, 156663, 156667, 2041923, 20419235, 20419237, 427309, B44C 122, C03C 1500, C03C 2506
Patent
active
049465465
ABSTRACT:
A method of adhering a metal to a surface of a substrate of silica, quartz, glass or sapphire is set forth. The surface to be metallized is first roughened by mechanical abrasion to obtain a roughness lying between 0.2 .mu.m and 0.7 .mu.m and is then subjected to a chemical treatment of etching by immersion in an aqueous solution of HF. According to the invention, the method further comprises the following steps of ion etching of the surface down to a depth less than 30 nm and then applying to the surface a first metallic adherence layer by cathode sputtering.
REFERENCES:
patent: 4458346 (1984-07-01), Mitsuyu et al.
patent: 4642163 (1987-02-01), Greschner et al.
Chemical Abstracts, vol. 106, No. 20, 1987, p. 321, No. 161376z, Sputter Plating of Copper on Quartz Plates.
Carson et al., Metallization of Glass Using Ion Injection, American Ceramic Society Bulletin, vol. 55, No. 5, 1976, pp. 530-532.
Miller Paul R.
Powell William A.
U.S. Philips Corporation
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