Method of manufacturing twin-ONO-type SONOS memory using...

Semiconductor device manufacturing: process – Making field effect device having pair of active regions... – Having insulated gate

Reexamination Certificate

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C438S267000, C438S596000

Reexamination Certificate

active

07005349

ABSTRACT:
A method of manufacturing a twin-ONO-type SONOS memory using a reverse self-alignment process, wherein an ONO dielectric layer is formed under a gate and physically separated into two portions using a reverse self-alignment process irrespective of photolithographic limits. To facilitate the reverse self-alignment, a buffer layer and spacers for defining the width of the ONO dielectric layer are adopted. Thus, the dispersion of trapped charges during programming and erasing can be appropriately adjusted, thus improving the characteristics of the SONOS. The present invention prevents the redistribution of charges in time after the programming and erasing operations.

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Lusky, et al, Entitled*, IEEE Electron Device Letters, 22(11):556-558 (Nov. 2001).
*Characterization of Channel Hot Electron Injection by the Subthreshold Slope of NROM Device.
Lusky, et al, Entitled*, IEEE Electron Device Letters, 23(9):556-558, (Sep. 2002).
*Electrons Retention Model for Localized Charge in Oxide-Nitride-Oxide (ONO) Dielectric.

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