Method of manufacturing semiconductors having improved temperatu

Radiation imagery chemistry: process – composition – or product th – Imaging affecting physical property of radiation sensitive... – Forming nonplanar surface

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430327, 430330, G03C 500

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active

060226722

ABSTRACT:
A method, system or device for forming a resist pattern applied to fine processing, such as that for preparation of a semiconductor device. The wafer transportation system for the process affected by processing conditions of the process, such as the temperature or time, is provided independently of the wafer transportation system for other processes in order to prevent heat transmission through a transport arm to assure a more accurate resist forming operation and to control the wafer transportation time between the processes more accurately and promptly. Pattern formation may be achieved more accurately through the use of a chemical amplification resist material subject to influences from the wafer environment.

REFERENCES:
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patent: 4924800 (1990-05-01), Tanaka
patent: 4985722 (1991-01-01), Ushijima et al.
patent: 5339128 (1994-08-01), Tateyama et al.
patent: 5401316 (1995-03-01), Shiraishi et al.

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