Method of manufacturing semiconductor devices

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material

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Details

438627, 438643, 438648, 438688, 438636, 438646, H01L 214763, H01L 2144

Patent

active

061566462

ABSTRACT:
A method of manufacturing a semiconductor device is provided in which a well patterned lead line structure is obtained. In one aspect of the invention, the method comprises steps of:

REFERENCES:
patent: 5665659 (1997-09-01), Lee et al.
patent: 5702564 (1997-12-01), Shen
patent: 5736458 (1998-04-01), Teng
patent: 5807760 (1998-09-01), Buckfeller et al.

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