Method of manufacturing semiconductor device with copper core bu

Details Method of manufacturing semiconductor device with copper core bu Method of manufacturing semiconductor device with copper core bu

1992-12-22

1995-07-18

Crane, Sara W.

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

257737, 257762, B44C 122, C03C 1500, C03C 2506, C23F 100

Patent

active

054338220

ABSTRACT:
A semiconductor device has circuit patterns formed on upper and lower surfaces of a laminated board with both surfaces lined with copper and interconnected by through holes, an IC chip mounted on the upper pattern, and external connection terminals mounted on the lower pattern, the external connection terminals comprising copper core bumps. According to a method of manufacturing such a semiconductor device, the same etching process as pattern etching for forming the circuit pattern are effected in bump forming regions on the circuit pattern formed by the resist pattern.

REFERENCES:
patent: 4926241 (1990-05-01), Carey
patent: 4927700 (1990-05-01), Nelson et al.
patent: 4991060 (1991-02-01), Kawakami et al.
patent: 5065228 (1991-11-01), Foster et al.
IBM Technical Disclosure Bulletin, vol. 20, No. 10, 03/1978, p. 3872.
Patent Abstracts of Japan, vol. 10, No. 99, Apr. 16, 1986.
Patent Abstracts of Japan, vol. 12, No. 167, May 19, 1988.
GAAS IC Symposium, Oct. 23, 1984, Boston, pp. 63-65.

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