4. Adhesive bonding and miscellaneous chemical manufacture
  5. Delaminating processes adapted for specified product
  6. Delaminating in preparation for post processing recycling step

Junichiro Shimizu

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Method of manufacturing semiconductor device with copper core bu

Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step
Patent

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Module for optical communications

Coherent light generators – Particular temperature control – Heat sink
Reexamination Certificate

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Optical device integrated head

Dynamic optical information storage or retrieval – Dynamic mechanism optical subsystem – Having power driven optical transducer assembly
Reexamination Certificate

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Optical module device driven by a single power supply

Active solid-state devices (e.g. – transistors – solid-state diode – Responsive to non-electrical signal – Electromagnetic or particle radiation
Reexamination Certificate

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Recording head

Dynamic information storage or retrieval – Storage or retrieval by simultaneous application of diverse... – Magnetic field and light beam
Reexamination Certificate

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Profile ID: LFUS-PAI-P-2001137

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