Method of manufacturing semiconductor device using flexible...

Semiconductor device manufacturing: process – Coating of substrate containing semiconductor region or of...

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C438S760000

Reexamination Certificate

active

06919281

ABSTRACT:
In a method of manufacturing a semiconductor device, a flexible tube connects at least part of a path extending from a reaction chamber to a detoxification device through a vacuum pump. The flexible tube has a tube body made of hard material, the tube body having projected parts and depressed parts and a cover provided over an outer surface of the tube body, the cover being made of elastic material, the cover being in contact with around the projected parts of the tube body and formed over the depressed parts of the tube body so that a vacant space is formed between the tube body and the cover. Then, a semiconductor substrate is disposed within the reaction chamber. The vacuum pump is activated to bring the reaction chamber into a pressure-reduced state. A reaction gas is supplied to the reaction chamber. Finally, the reaction gas causes to react to thereby deposit a reactant on the semiconductor substrate.

REFERENCES:
patent: 3028289 (1962-04-01), Roberts et al.
patent: 4147185 (1979-04-01), Hines
patent: 5279333 (1994-01-01), Lawrence
patent: 5379804 (1995-01-01), Dunn et al.
patent: 5380050 (1995-01-01), Sanders et al.
patent: 5413147 (1995-05-01), Moreiras et al.
patent: 5497809 (1996-03-01), Wolf
patent: 5520223 (1996-05-01), Iorio et al.
patent: 5678610 (1997-10-01), Scarazzo et al.
patent: 5706864 (1998-01-01), Pfleger
patent: 5848618 (1998-12-01), Guest
patent: 5901755 (1999-05-01), Winter et al.
patent: 6216742 (2001-04-01), Masui et al.
patent: 6310284 (2001-10-01), Ikeda
patent: 09-273696 (1997-10-01), None
patent: 10-238689 (1998-09-01), None

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Method of manufacturing semiconductor device using flexible... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method of manufacturing semiconductor device using flexible..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of manufacturing semiconductor device using flexible... will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-3398359

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.