Method of manufacturing semiconductor device

Semiconductor device manufacturing: process – Making field effect device having pair of active regions... – Having insulated gate

Reexamination Certificate

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Details

C438S196000, C438S219000, C257SE21546, C257SE21642

Reexamination Certificate

active

07858467

ABSTRACT:
A method of manufacturing a semiconductor device according to an embodiment of the present invention includes forming, on a surface of a semiconductor substrate, an isolation trench including sidewall parts and a bottom part, or a stepped structure including a first planar part, a second planar part, and a step part located at a boundary between the first planar part and the second planar part, and supplying oxidizing ions or nitriding ions contained in plasma generated by a microwave, a radio-frequency wave, or electron cyclotron resonance to the sidewall parts and the bottom part of the isolation trench or the first and second planar parts and the step part of the stepped structure by applying a predetermined voltage to the semiconductor substrate, to perform anisotropic oxidation or anisotropic nitridation of the sidewall parts and the bottom part of the isolation trench or the first and second planar parts and the step part of the stepped structure.

REFERENCES:
patent: 5183775 (1993-02-01), Levy
patent: 2007/0026632 (2007-02-01), Yamamoto
patent: 5-226324 (1993-09-01), None
patent: 2002-33381 (2002-01-01), None
patent: 2006-222203 (2006-08-01), None
patent: 2006-286662 (2006-10-01), None
patent: 2009-200483 (2009-09-01), None
Sep. 21, 2010. I Examiner: Initial if reference considered, whether or not citation is in conformance with Mpep 609. Draw line through citation if not in conformance and not considered. Include copy of this form with next communication to applicant. •.

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