Semiconductor device manufacturing: process – Making field effect device having pair of active regions... – Having insulated gate
Reexamination Certificate
2007-09-07
2009-10-20
Coleman, W. David (Department: 2823)
Semiconductor device manufacturing: process
Making field effect device having pair of active regions...
Having insulated gate
C257S314000, C257S315000, C257SE21170, C257SE21626, C257SE21640, C438S184000, C438S230000, C438S265000
Reexamination Certificate
active
07605044
ABSTRACT:
A method of manufacturing a semiconductor device including at least one step of: forming a transistor on and/or over a semiconductor substrate; forming silicide on and/or overa gate electrode and a source/drain region of the transistor; removing an uppermost oxide film from a spacer of the transistor; and forming a contact stop layer on and/or over the entire surface of the substrate including the gate electrode.
REFERENCES:
patent: 7371629 (2008-05-01), Fu et al.
patent: 7423330 (2008-09-01), Satoh
patent: 2002/0127763 (2002-09-01), Arafa et al.
patent: 2004/0072435 (2004-04-01), Quek
patent: 2008/0096331 (2008-04-01), Chen et al.
Coleman W. David
Dongbu Hi-Tek Co., Ltd.
Kim Su C
Sherr & Vaughn, PLLC
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