Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step
Patent
1989-05-30
1990-08-28
Powell, William A.
Adhesive bonding and miscellaneous chemical manufacture
Delaminating processes adapted for specified product
Delaminating in preparation for post processing recycling step
156626, 156634, 156643, 156652, 156656, 1566611, 20412965, B44C 122, C23F 102, C03C 1500, C03C 2506
Patent
active
049522728
ABSTRACT:
A probe head for use with equipment for testing a semiconductor device such as a large scale integrated circuit (LSI) includes electrode pads are formed on a circuit substrate, and a pad protecting conductive layer formed on the pads. A probe pin forming material is grown which is worked into a pin-like configuration, thereby improving a pin assembling property of a probe head portion and this realizes highly accurate pinning with high reliability.
REFERENCES:
patent: 4585991 (1986-04-01), Reid et al.
Akiba Yutaka
Fujita Tsuyoshi
Fujiwara Akio
Hirota Kazuo
Kasukabe Susumu
Hitachi , Ltd.
Powell William A.
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