Method of manufacturing nonvolatile semiconductor memory devices

Semiconductor device manufacturing: process – Making field effect device having pair of active regions... – Having insulated gate

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438257, H01L 218247

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active

059899590

ABSTRACT:
A silicon nitride film and a silicon oxide film are deposited in that order on a WSi film. In a single session of lithography, the gate electrode of a memory cell and the gate electrode of a transistor constituting a peripheral circuit are formed. The silicon oxide film makes a mask used to form a floating gate of the memory cell. The silicon nitride film makes a mask used to form a common source region by etching a gate oxide film and a field oxide film. The silicon nitride film covers the WSi film to prevent impurities from entering the WSi film when impurities are introduced into the common source region. This prevents abnormal oxidation in a subsequent process.

REFERENCES:
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patent: 5445981 (1995-08-01), Lee
patent: 5635416 (1997-06-01), Chen et al.
patent: 5756385 (1998-05-01), Yuan et al.

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