Method of manufacturing flash memory device

Semiconductor device manufacturing: process – Making field effect device having pair of active regions... – Having insulated gate

Reexamination Certificate

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C257SE21422, C438S270000

Reexamination Certificate

active

07615450

ABSTRACT:
Disclosed herein is a method of fabricating a flash memory device. The method includes providing a semiconductor substrate that includes an active region and a field region. A tunnel insulating layer and a first conductive layer are formed in the active region, and an isolation structure is formed in the field region. The method includes forming a dielectric layer along a surface of the first conductive layer and the isolation structure, forming a capping layer along a surface of the dielectric layer, and forming a hard mask layer over the capping layer. The method also includes performing a first etchant process to etch the capping layer and the dielectric layer over the isolation structure forming holes. The method further includes performing a second etch process to remove the hard mask layer to form an undercut in the dielectric layer. Still further, the method includes forming a second conductive layer over a structure in which the holes and the undercut are formed.

REFERENCES:
patent: 6468862 (2002-10-01), Tseng
patent: 6914013 (2005-07-01), Chung
patent: 6987047 (2006-01-01), Iguchi et al.
patent: 7084031 (2006-08-01), Lee
patent: 2004-153049 (2004-05-01), None
patent: 10-2005-0070529 (2005-07-01), None

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