Method of manufacturing dynamic random access memory

Semiconductor device manufacturing: process – Making field effect device having pair of active regions... – Having insulated gate

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

438254, 438397, H01L 218242

Patent

active

058518762

ABSTRACT:
A method of forming DRAMs that utilizes cap layers and spacers to surround the gate and bit line so that the necessary contact openings in DRAM can be formed in two self-aligned contact opening processing operations. Furthermore, the DRAM capacitor is formed by alternately depositing two types of insulating layers, one over the other, with each insulating layer having a different etching rate, and then performing an etching operation. Therefore, a deer antler-shaped mold is formed that can ultimately be used to fabricate a storage electrode with a large surface area.

REFERENCES:
patent: 5128273 (1992-07-01), Ema
patent: 5135883 (1992-08-01), Bae et al.
patent: 5677222 (1997-10-01), Tseng
patent: 5706164 (1998-01-01), Jeng
patent: 5770499 (1998-06-01), Kwok et al.
patent: 5807782 (1998-09-01), Koh et al.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Method of manufacturing dynamic random access memory does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method of manufacturing dynamic random access memory, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of manufacturing dynamic random access memory will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-2046915

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.