Semiconductor device manufacturing: process – Making field effect device having pair of active regions... – Having insulated gate
Reexamination Certificate
2005-06-21
2005-06-21
Dang, Phuc T. (Department: 2818)
Semiconductor device manufacturing: process
Making field effect device having pair of active regions...
Having insulated gate
C438S283000, C438S378000
Reexamination Certificate
active
06908805
ABSTRACT:
The present invention is provided to manufacture a dual gate oxide film. According to the present invention, it is possible to obtain a high-quality NO gate oxide film for high voltage and a high-quality NO gate oxide film for low voltage where nitrogen is distributed uniformly in the entire oxide films by carrying out a rapid annealing process in an inert atmosphere after carrying out an NO annealing process in order to prevent a phenomenon that nitrogen is not distributed uniformly and segregated in a gate oxide film for high voltage due to application of the NO annealing process after forming a gate oxide film for low voltage.
REFERENCES:
patent: 6037224 (2000-03-01), Buller et al.
patent: 6261972 (2001-07-01), Tews et al.
patent: 6642156 (2003-11-01), Gousev et al.
patent: 6784060 (2004-08-01), Ryoo
Cho Jung Il
Lee Seung Cheol
Park Sang Wook
Dang Phuc T.
Hynix / Semiconductor Inc.
Marshall & Gerstein & Borun LLP
LandOfFree
Method of manufacturing dual gate oxide film does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Method of manufacturing dual gate oxide film, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of manufacturing dual gate oxide film will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3483354