Method of manufacturing CMOS semiconductor devices by forming a

Semiconductor device manufacturing: process – Making field effect device having pair of active regions... – Having insulated gate

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

438683, H01L 218238

Patent

active

058743316

ABSTRACT:
A manufacturing method of simplifying the process and permitting SAC and the salicide technique by effecting the salicide process without removing a cap portion is provided. A manufacturing method of this invention includes a step of exposing part of the side surface of a gate electrode by effecting the anisotropic etching process in an over-etching fashion at the time of formation of side walls and converting a electrode material used as the gate electrode into silicide from the side surface of the exposed gate electrode.

REFERENCES:
patent: 4876213 (1989-10-01), Pfiester
patent: 5571735 (1996-11-01), Mogami et al.
patent: 5668024 (1997-09-01), Tsai et al.
patent: 5721175 (1998-02-01), Kunishima et al.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Method of manufacturing CMOS semiconductor devices by forming a does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method of manufacturing CMOS semiconductor devices by forming a , we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of manufacturing CMOS semiconductor devices by forming a will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-306412

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.