Semiconductor device manufacturing: process – Making field effect device having pair of active regions... – Having insulated gate
Patent
1997-03-24
1999-02-23
Chaudhari, Chandra
Semiconductor device manufacturing: process
Making field effect device having pair of active regions...
Having insulated gate
438683, H01L 218238
Patent
active
058743316
ABSTRACT:
A manufacturing method of simplifying the process and permitting SAC and the salicide technique by effecting the salicide process without removing a cap portion is provided. A manufacturing method of this invention includes a step of exposing part of the side surface of a gate electrode by effecting the anisotropic etching process in an over-etching fashion at the time of formation of side walls and converting a electrode material used as the gate electrode into silicide from the side surface of the exposed gate electrode.
REFERENCES:
patent: 4876213 (1989-10-01), Pfiester
patent: 5571735 (1996-11-01), Mogami et al.
patent: 5668024 (1997-09-01), Tsai et al.
patent: 5721175 (1998-02-01), Kunishima et al.
Chaudhari Chandra
Kabushiki Kaisha Toshiba
LandOfFree
Method of manufacturing CMOS semiconductor devices by forming a does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Method of manufacturing CMOS semiconductor devices by forming a , we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of manufacturing CMOS semiconductor devices by forming a will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-306412