Method of manufacturing an enhanced thermal dissipation...

Details Method of manufacturing an enhanced thermal dissipation... Method of manufacturing an enhanced thermal dissipation...

2006-03-21

2006-03-21

Chambliss, Alonzo (Department: 2814)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Metallic housing or support

C257S707000, C257S713000, C257S717000, C257S720000, C361S707000, C361S709000, C361S710000

Reexamination Certificate

active

07015072

ABSTRACT:
In one aspect, the present invention relates to a method of manufacturing an integrated circuit package, the method including installing a carrier onto a substrate, attaching a semiconductor die to the substrate, and aligning an assembly over the semiconductor die, wherein the assembly includes a heat sink and a thermally conductive element. This aspect further includes resting the assembly on the carrier such that the thermally conductive element does not directly contact the semiconductor die, and encapsulating the thermally conductive element and the heat sink such that a portion of the heat sink is exposed to the surroundings of the package.

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