Active solid-state devices (e.g., transistors, solid-state diode
Encapsulated
Inventor
active
Enhanced thermal dissipation integrated circuit package
High power dissipation plastic encapsulated package for integrat
Integrated carrier ring/stiffener and method for manufacturing a
Integrated circuit package with bonding planes on a ceramic...
Method of manufacturing a flexible integrated circuit...
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Profile ID: LFUS-PAI-P-1344396