Method of manufacturing a semiconductor device with a BiCMOS cir

Semiconductor device manufacturing: process – Making field effect device having pair of active regions... – Having insulated gate

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

438234, H01L 218238

Patent

active

059703326

ABSTRACT:
A method of manufacturing a semiconductor device with a bipolar transistor (1) and a MOS transistor (2) formed in a silicon body (3) which for this purpose is provided with a field insulation region (4) by which semiconductor regions (6, 7) adjoining a surface (5) of said body are mutually insulated. A first region (6) is destined for the bipolar transistor and a second region (7) for the MOS transistor. The second region is provided with a gate dielectric (10). Then an electrode layer of non-crystalline silicon (11) is provided on the surface, which electrode layer is provided with a doping and in which electrode layer subsequently an emitter electrode (12) is formed on the first region and a gate electrode (13) on the second region. The electrode layer is provided with a doping by means of a treatment whereby a first dopant is provided at the area of the first region and a second dopant at the area of the second region, the first dopant being provided to a concentration such that the emitter zone of the transistor can be formed through diffusion from the emitter electrode to be formed in the electrode layer, while the second dopant is provided to a concentration lower than that of the first dopant. Owing to the comparatively low doping level, gate oxide breakdown is prevented during plasma etching and ion implantation.

REFERENCES:
patent: 5047357 (1991-09-01), Eklund
patent: 5089429 (1992-02-01), Hsu
patent: 5278085 (1994-01-01), Maddox, III et al.
patent: 5496744 (1996-03-01), Ishimaru

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Method of manufacturing a semiconductor device with a BiCMOS cir does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method of manufacturing a semiconductor device with a BiCMOS cir, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of manufacturing a semiconductor device with a BiCMOS cir will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-2068303

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.