Method of manufacturing a semiconductor device with...

Semiconductor device manufacturing: process – Making field effect device having pair of active regions... – Having insulated gate

Reexamination Certificate

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C438S267000

Reexamination Certificate

active

06984558

ABSTRACT:
Method of manufacturing a semiconductor device comprising a semiconductor body (1) which is provided at a surface (2) with a non-volatile memory comprising a memory cell with a gate structure (4) with an access gate (19) and a gate structure (3) with a control gate (5) and a charge storage region situated between the control gate (5) and the semiconductor body (1), such as a floating gate (6). In this method on the surface (2) of the semiconductor body (1) a first one of said gate structures is formed with side walls (10) extending substantially perpendicular to the surface, a conductive layer is deposited (13) on and next to said first gate-structure, the conductive layer is subjected to a planarizing treatment until the first gate structure is exposed and the so planarized conductive layer is patterned so as to form at least a part of the other gate structure adjoining the first gate structure. Said patterning of the planarized conductive layer is performed in that the planarized conductive layer (14) is etched back so as to expose an upper portion (15) of the side walls of the first gate structure, a spacer (18) is formed on the exposed upper portion (15) of the side walls of first gate structure and the conductive layer (16) is etched anisotropically using the spacer as a mask. Thus very small memory cells can be realized.

REFERENCES:
patent: 6335554 (2002-01-01), Yoshikawa
patent: 6476440 (2002-11-01), Shin
patent: 6632714 (2003-10-01), Yoshikawa
International Search Report WO 2003/01512 A3.

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