Method of manufacturing a semiconductor device using trench isol

Semiconductor device manufacturing: process – Making field effect device having pair of active regions... – Having insulated gate

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

438430, H01L 21762

Patent

active

058307966

ABSTRACT:
The present invention discloses a method of manufacturing a semiconductor device, comprising the steps of: forming a transistor on a silicon substrate; forming a trench by etching a selected portion of the silicon substrate; and forming an interlayer insulating film on the resulting structure after forming said trench, thereby forming a device isolation film in the trench.

REFERENCES:
patent: 4661202 (1987-04-01), Ochii
patent: 4980306 (1990-12-01), Shimbo
patent: 5387540 (1995-02-01), Poom et al.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Method of manufacturing a semiconductor device using trench isol does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method of manufacturing a semiconductor device using trench isol, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of manufacturing a semiconductor device using trench isol will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-688738

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.