Method of manufacturing a semiconductor device that includes...

Semiconductor device manufacturing: process – Making field effect device having pair of active regions... – On insulating substrate or layer

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C438S781000, C438S787000

Reexamination Certificate

active

06939749

ABSTRACT:
A process for fabricating a thin film transistor, which comprises crystallizing an amorphous silicon film, forming thereon a gate insulating film and a gate electrode, implanting impurities in a self-aligned manner, adhering a coating containing a catalyst element which accelerates the crystallization of the silicon film, and annealing the resulting structure at a temperature lower than the deformation temperature of the substrate to activate the doped impurities. Otherwise, the catalyst element can be incorporated into the structure by introducing it into the impurity region by means of ion implantation and the like. Also a process for fabricating a thin film transistor, which comprises forming a gate electrode, a gate insulating film, and an amorphous silicon film on a substrate, implanting impurities into the amorphous silicon film to form source and drain regions as the impurity regions, introducing a catalyst element into the impurity region by adhering a coating containing the catalyst element of by means of ion doping and the like, and annealing the resulting structure at a temperature lower than the deformation temperature of the substrate to activate the doped impurities.

REFERENCES:
patent: 4378628 (1983-04-01), Levinstein et al.
patent: 4619034 (1986-10-01), Janning
patent: 4746628 (1988-05-01), Takafuji et al.
patent: 4772927 (1988-09-01), Saito et al.
patent: 4810673 (1989-03-01), Freeman
patent: 4894352 (1990-01-01), Lane et al.
patent: 4925812 (1990-05-01), Gould
patent: 4943837 (1990-07-01), Konishi et al.
patent: 4965213 (1990-10-01), Blake
patent: 5013691 (1991-05-01), Lory et al.
patent: 5037766 (1991-08-01), Wang
patent: 5064775 (1991-11-01), Chang
patent: 5124769 (1992-06-01), Tanaka et al.
patent: 5141880 (1992-08-01), Inoue et al.
patent: 5147826 (1992-09-01), Liu et al.
patent: 5227315 (1993-07-01), Frisina et al.
patent: 5248623 (1993-09-01), Muto et al.
patent: 5252502 (1993-10-01), Havemann
patent: 5266507 (1993-11-01), Wu
patent: 5275851 (1994-01-01), Fonash et al.
patent: 5275977 (1994-01-01), Otsubo et al.
patent: 5294555 (1994-03-01), Mano et al.
patent: 5300449 (1994-04-01), Okumura
patent: 5313075 (1994-05-01), Zhang et al.
patent: 5313076 (1994-05-01), Yamazaki et al.
patent: 5366912 (1994-11-01), Kobayashi
patent: 5395804 (1995-03-01), Ueda
patent: 5403772 (1995-04-01), Zhang et al.
patent: 5409851 (1995-04-01), Oh
patent: 5413967 (1995-05-01), Matsuda et al.
patent: 5466612 (1995-11-01), Fuse et al.
patent: 5510146 (1996-04-01), Miyasaka
patent: 5523257 (1996-06-01), Yamazaki et al.
patent: 5595944 (1997-01-01), Zhang et al.
patent: 5646424 (1997-07-01), Zhang et al.
patent: 5668019 (1997-09-01), Kobayashi et al.
patent: 5773846 (1998-06-01), Zhang et al.
patent: 5821138 (1998-10-01), Yamazaki et al.
patent: 5837614 (1998-11-01), Yamazaki et al.
patent: 5858819 (1999-01-01), Miyasaka
patent: 5866932 (1999-02-01), Yamazaki et al.
patent: 5936291 (1999-08-01), Makita et al.
patent: 6020224 (2000-02-01), Shimogaichi et al.
patent: 6060725 (2000-05-01), Zhang et al.
patent: 6136325 (2000-10-01), Linde et al.
patent: 6261875 (2001-07-01), Zhang et al.
patent: 6586346 (2003-07-01), Yamazaki et al.
patent: 0 486 284 (1992-05-01), None
patent: 59-110115 (1984-06-01), None
patent: 61-063020 (1986-04-01), None
patent: 63-056912 (1988-03-01), None
patent: 63-142807 (1988-06-01), None
patent: 02-042419 (1990-02-01), None
patent: 02-140915 (1990-05-01), None
patent: 03-036768 (1991-02-01), None
patent: 03-166372 (1991-07-01), None
patent: 03-219644 (1991-09-01), None
patent: 04-134869 (1992-05-01), None
patent: 04-190329 (1992-07-01), None
patent: 05-175132 (1993-07-01), None
patent: 05-315355 (1993-11-01), None
Dvurechenskii et al., “Transport Phenomena in Amorphous Silicon Doped by Ion Implantation of 3D Metals”, pp. 635-640, 1986 Akademikian Lavrentev Prospekt 13, 630090 Novosibirsk 90, USSR.
Hempel et al, “Needle-Like Crystallization of Ni Doped Amorphous Silicon Thin Films”, pp. 921-924, 1993, Solid State Communications, vol. 85, No. 11.
Hayzelden et al., “In Situ Transmission Electron Microscopy Studies of Suicide-Mediated Crystallization of Amorphous Silicon”, 3 pages, 1991.
Kakkad et al., “Crystallized Si Films by Low-Temperature Rapid Thermal Annealing of Amorphous Silicon”, pp. 2069-2072, Mar. 1, 1989, J. Appl. Phys., vol. 65, No. 5.
Liu et al., “Polycrystalline Silicon Thin Film Transistors on Corning 7059 Glass Substrates Using Short Time, Low-Temperature Processing” pp. 2554-2556, May 17, 1993, Appl. Phys. Lett., vol. 62, No. 20.
Liu et al., “Selective Area Crystallization of Amorphous Silicon Films by Low-Temperature Rapid Thermal Annealing”, pp. 660-662, Aug. 14, 1989, Appl. Phys. Lett., vol. 55, No. 7.
Kakkad et al., “Low Temperature Selective Crystallization of Amorphous Silicon”, pp. 66-68, 1989, Journal of Non-Crystalline Solids, vol. 115.
Kawazu et al., “Low-Temperature Crystallization of Hydrogenated Amorphous Silicon Induced by Nickel Silicide Formation”, pp. 2698-2704, Dec. 1990, Japanese Journal of Applied Physics, vol. 29, No. 12.
Hayzelden et al., “In Situ Transmission Electron Microscopy Studies of Silicide-Mediated Crystallization of Amorphous Silicon”, Appl. Phys. Lett., Jan. 13, 1992, vol. 60, No. 2, pp. 225-227.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Method of manufacturing a semiconductor device that includes... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method of manufacturing a semiconductor device that includes..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of manufacturing a semiconductor device that includes... will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-3433075

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.