Semiconductor device manufacturing: process – With measuring or testing – Electrical characteristic sensed
Reexamination Certificate
2006-03-28
2006-03-28
Smith, Bradley K. (Department: 2891)
Semiconductor device manufacturing: process
With measuring or testing
Electrical characteristic sensed
C438S017000, C438S014000
Reexamination Certificate
active
07018857
ABSTRACT:
A manufacturing method for improving the yield in a semiconductor manufacturing process and reducing the manufacturing cost produces a semiconductor device that is inexpensively manufactured and has a high reliability by reliably making contact during inspection with a suitable pressing force, while limiting damage to an electrode pad even when many inspected electrodes are inspected. A substrate used for inspection of the semiconductor device has a beam, a probe on the beam having a projecting shape for coming in contact with an electrode (electrode pad) of the semiconductor device, and a secondary electrode electrically connected to the probe through an electrically conductive member disposed on the side of the beam opposed to the side where the probe is provided. In an inspecting process, an inspecting device having a layer having many projections formed in the probe come in contact with the electrode pad of the semiconductor device.
REFERENCES:
patent: 6358762 (2002-03-01), Kohno et al.
patent: 6714030 (2004-03-01), Kohno et al.
patent: 9-133711 (1997-05-01), None
patent: 2001-250851 (2001-09-01), None
Aoki Hideyuki
Aono Takanori
Kanamaru Masatoshi
Kawakami Kenji
Nagata Tatsuya
Antonelli, Terry Stout and Kraus, LLP.
Renesas Technology Corp.
Smith Bradley K.
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