Method of manufacturing a semiconductor device

Semiconductor device manufacturing: process – Making field effect device having pair of active regions... – Having insulated gate

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438250, 438393, H01L 218238

Patent

active

059337192

ABSTRACT:
The proposed semiconductor device can provide a capacitor having an excellent capacitance controllability thereof and a high reliability thereof. A method of manufacturing a semiconductor device comprises the steps of: forming a first insulating film on a semiconductor substrate on which a lower capacitor electrode has been formed; removing the first insulating film at a capacitor forming region on the lower capacitor electrode; forming a second insulating film on the semiconductor substrate; forming a conductive film on the formed second insulating film; patterning the conductive film and the second insulating film, to leave both the films at least at the capacitor forming region; patterning the first insulating film, to form a contact hole with the lower capacitor electrode at a region other than the capacitor forming region; and dry etching the lower capacitor electrode, to remove a natural oxide film formed at a bottom of the contact hole.

REFERENCES:
patent: 5065220 (1991-11-01), Paterson et al.
patent: 5395782 (1995-03-01), Ohkoda et al.
patent: 5591663 (1997-01-01), Nasu et al.
patent: 5670808 (1997-09-01), Nishihori et al.

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