Semiconductor device manufacturing: process – Making field effect device having pair of active regions... – Having insulated gate
Reexamination Certificate
2007-09-11
2007-09-11
Nhu, David (Department: 2818)
Semiconductor device manufacturing: process
Making field effect device having pair of active regions...
Having insulated gate
C438S289000, C438S238000, C438S381000, C257SE21008, C257S654000, C257S657000, C256S013000, C256S013000
Reexamination Certificate
active
11101672
ABSTRACT:
Disclosed herein is a method of manufacturing a flash memory device. According to the present invention, a method of manufacturing a NAND flash memory device having a memory cell and a select transistor, wherein a graph showing the relation between the length of a gate electrode of the select transistor and the leakage current of the select transistor, and a graph showing the relation between an ion implant dose for controlling a threshold voltage of a memory cell and the leakage current of the select transistor are provided includes the steps of finding the leakage current of a select transistor, which corresponds to the length of a gate electrode of a current select transistor, and finding an ion implant dose for controlling a threshold voltage of a memory cell, which corresponds to the leakage current, and finding the leakage current of a select transistor, which allows the ion implant dose for controlling the threshold voltage of the memory cell to become an ion implant dose for controlling a threshold voltage of a desired memory cell, and finding and increasing the length of the gate electrode of the select transistor, which corresponds to the leakage current of the select transistor.
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Hynix / Semiconductor Inc.
Marshall & Gerstein & Borun LLP
Nhu David
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