Method of manufacturing a micro-electrical-mechanical system

Details Method of manufacturing a micro-electrical-mechanical system Method of manufacturing a micro-electrical-mechanical system

2006-12-26

2006-12-26

Mulpuri, Savitri (Department: 2812)

Semiconductor device manufacturing: process

Making device or circuit responsive to nonelectrical signal

Physical stress responsive

C438S052000, C438S113000, C438S464000

Reexamination Certificate

active

07153716

ABSTRACT:
Micro-electrical-mechanical systems are fabricated in a substrate having a sacrificial layer sandwiched between two semiconductor layers. The semiconductor layers are selectively etched to create non-etched frames and etched microstructures immobilized within the frames by the sacrificial layer. An adhesive sheet is attached to one surface of the substrate, and the substrate is diced into chips, each including one frame and one immobilized microstructure. The sacrificial layer is then selectively etched to free a movable member in each microstructure. Finally, the chips are detached from the adhesive sheet, each chip becoming a micro-electrical-mechanical system. This fabrication method provides a simple and inexpensive way to avoid damage to the microstructure during the dicing process.

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